Webinar: ANSYS Icepak 12.0

ANSYS Icepak 12.0 represents a major step forward for the simulation of electronics thermal management at the component, board or system level. The 12.0 release introduces new and enhanced technology for meshing complex geometry, new solutions for printed circuit board (PCB) and package thermal analysis, a new PCB trace Joule heating capability, a new power map import option from SIwave, and many other new features and enhancements. The advances in ANSYS Icepak 12.0 enable engineers designing electronic components to improve design performance, reduce the need for physical prototypes and shorten the time-to-market in the highly competitive electronics industry.

View the ANSYS Icepak 12.0 Webinar