Webinar: Package and Board Thermal Design

A printed circuit board comprises alternating layers of copper and dielectric material, current carrying traces and vias. It is important to determine the heat flow through a printed circuit board so that the temperature mapping on the attached components and packages can be determined accurately. Accurate prediction of the hot spots and component temperatures on printed circuit boards can be accomplished via the use of information from ECAD files.

This recording is focused on the modeling of Joule heating and use of ECAD data in ANSYS Icepak software for accurate hot spot and component temperature determination by taking the trace layer non-homogeneity into account. Step-by-step instructions of importing ECAD files and using the extracted information on a sample model will be shown.

View the Package and Board Thermal Design Webinar