Webinar: ANSYS Electronics System Level Thermal Management Solutions

In this webinar, we will focus on ANSYS thermal design and fluid flow analysis solutions for electronics systems. During this webinar we will cover CAD data import, complex geometric modeling, fan selection and fan placement. Various design methodologies will be presented using a generic desktop box and a telecom rack system as we examine component temperatures, air velocity and pressure profiles based for various design configurations. We will also examine the design of flow elements as well as system and sub-system modeling using zoom in modeling. Primary product focus will be on ANSYS Icepak.

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