Webinar: Coupled EM-Circuit Parametric Signal Integrity Simulation Using High-Performance Compute Clusters

Electronics design leaders often perform thousands of parametric signal integrity simulations on a single design. A single high-speed serial link, for example, may have several differential traces, layer-to-layer vias, IC packaging with escape routing, and connectors in the path. Each of these structures may have several parameters that are varied in order to characterize design sensitivity. The number of coupled electromagnetic-circuit simulations can quickly number into the thousands. This presentation shows how engineers can utilize high-performance compute clusters to efficiently solve and analyze large parametric variations using Designer SI.

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