ANSYS Solutions for Electronic Component and Board Reliability

This focused topic recorded webinar is an introduction to ANSYS structural mechanics solutions for component and end equipment electronics including networking and computers, aerospace and defense and automotive electronics. Upcoming opportunities for gaining in-depth proficiency in the ANSYS software skills and techniques needed to implement the methodologies will be announced.

Agenda:

• Solutions to board-level structural design challenges.
• The PCB level reliability is an engineering concern since a number of design decisions such as board mounting stand-offs and heat sink retention force as well as end use loading conditions affect the reliability of the components. This section will introduce ANSYS solutions that aid PCB Mechanical design for reliability.
• Methodology for high-cycle fatigue life estimation electronic component-board interconnects.
• Mechanical failures are not only determined by the levels of stresses developed, but also on the ability of the selected interconnects such as solder balls, columns and lead frame joints to withstand those stresses. This section will discuss the complementary role played by ANSYS Mechanical simulation with existing vibration testing methods for determining the life of the joints.
• Chip level thermal cycling reliability of underfilled solder joints.
• For fabless chip vendors as well as packaging houses using flip chip technology for chip level interconnection, the role played by solder bumps, underfill, mask layer and UBM on end use stage reliability can be a complex riddle. ANSYS thermo-mechanical reliability analysis targeted to this level can help gain a better understanding of the compatibility issues. This section will offer a sneak peak at simulation methodologies used in flip chip engineering.
• ANSYS solutions to SMT reflow process related challenges.

View the ANSYS Solutions for Electronic Component and Board Reliability webinar